NUSIL Technology LLC, the global leader in silicone materials for the medical implants, aerospace, electronics and engineering markets, introduces R-2165, the newest robust silicone solution for the protection of electronic components and systems such as sensors, relays, and connectors.
According to Nusil, it launches R-2165 to respond to the growing market need for applications in which silicone is desired due to its excellent ability to perform at elevated temperatures. R-2165 is gray in color, pourable, and exhibits moderate thermal conductivity of 0.6 W/mK. Similar to its portfolio affiliates for this class of materials, it uses platinum addition cure chemistry, offering minimal shrinkage, no cure by-products, and a cure time that can be accelerated with heat.
“R-2165 is the latest addition to NuSil’s diverse portfolio of silicones designed for potting and encapsulating components in need of the high level of power required by many of today’s applications, such as data centres and faster data transfer in general,” said Bob Umland, Marketing & Sales Director, Electronics and Engineering. “Our commitment to continuous growth means that we understand the many challenges engineers face and that we strive to ensure they have choices in silicone materials that can handle the harsh environments electronic components must withstand in today’s environments.”