Dow introduces octylphenol-free rubber-to-metal bonding agent

Rubber-to-metalRubber-to-metal bonding is essential for automotive under-the-hood, powertrain and chassis anti-vibration applications.

Part of a product family from US chemicals supplier Dow that includes Megum and other Thixon rubber-to-substrate bonding agents, are new Thixon P-11-F and P-22 primer systems that comply with a Reach-compliant octylphenol-free formulation.

“Dow has produced robust, flexible primers for many applications,” said Dr. Stefan Dehnicke, global technology manager – Specialty Adhesives at Dow Automotive. “This enables primer standardisation and consolidation while meeting key industry performance requirements.”

Thixon P-11-F and P-22 octylphenol-free primers can be used separately or together with cover agents. They are deemed to be robust, flexible primers for various substrates and demonstrate product advantages that include:

  • High performance across key parameters for one and two-coat bonding
  • Passing requirements for boiling water and salt-spray tests
  • Balanced formulation free of MIBK (Thixon P-22)